At the Mobile World Congress 2019 this week, Intel is showcasing a number of products and partnerships aimed at processing, moving and storing data in the dawning 5G era.
Intel cites a prediction from Cisco, to the effect that global Internet protocol (IP ) traffic will triple over the next 5 years. An "exponential" increase in mobile subscribers, in Internet of Things devices, and new 5G use cases will add to the complexity and cost of network construction and operation.
Intel is highlighting several projects, aimed at back-end development of th 5G platform.
Intel announced that Ericsson and ZTE are planning to adopt its ‘Snow Ridge' system-on-a-chip (SoC) in their 5G base station designs. Snow Ridge is a new 10nm chip, developed specifically for 5G wireless access and edge computing. It's slated for production starting in the second half of this year.
Intel also announced a new Xeon D processor, code-named ‘Hewitt Lake,' with a "power-efficient SoC configuration' tailored to provide improved performance" for network edge and storage solutions.
Intel's FPGA Programmable Acceleration Card N3000 (PAC N3000), code-named ‘Vista Creek,' is designed to accelerate many virtualized workloads, ranging from 5G radio access networks, to core network applications. Highly customizable, it's intended to aid service providers in creating profitable 5G services. The PAC N3000 is expected to be available in Q3 of this year.
Intel and Skyworks are collaborating on optimizing 5G radio-frequency solutions for Intel's upcoming XMM 8160 modem. This work is based on Intel's single-chip SMARTi RF transceiver and Skyworks' Sky5 compact multi-band front end modules. The platform is expected to support 2G, 3G, CDMA, TDSCDMA, LTE, 5G and GNSS. Product samples are expected this summer, with the Intel XMM 8160 modem shipping in commercial devices in 2020.
Additionally, Intel announced that the Fibocam FG100 M.2 module will integrate the Intel 5G modem. LTE gateways are scheduled to become available later this year, and 5G gateways should follow in 2020. Intel notes that a number of gateway manufacturers have confirmed plans to use Intel modems and the Fibocam M.2 module.
Photo: Sandra Rivera (center), Intel Senior Vice President and General Manager of the Network Platforms Group, tours Intel's booth at Mobile World Congress on Sunday, Feb. 24, 2019.